2 Layer FR4 Printed Circuit Board With Wire Bonding
1 2 Layer FR4 substrate material printed circuit board.
2 Double layer copper, copper thickness is 35um/35um.
3 Finished pcb thickness is 1.6mm.
4 PCB with wire bonding.
5 Immersion Gold treatment
6 2 layer pcb with 4/4mil min line space and width.
7 Green solder mask and white silkscreen.
8 Need customer to send us the gerber file or PCB file
| NO | Item | Capability |
| 1 | Layer Count | 1-24 Layers |
| 2 | Board Thickness | 0.1mm-6.0mm |
| 3 | Finished Board Max Size | 700mm*800mm |
| 4 | Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
| 5 | Warp | <0.7% |
| 6 | Major CCL Brand | KB/NanYa/ITEQ/ShengYi/Rogers Etc |
| 7 | Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET |
| 8 | Drill Hole Diameter | 0.1mm-6.5mm |
| 9 | Out Layer Copper Thickness | 1/2OZ-8OZ |
| 10 | Inner Layer Copper Thickness | 1/3OZ-6OZ |
| 11 | Aspect Ratio | 10:1 |
| 12 | PTH Hole Tolerance | +/-3mil |
| 13 | NPTH Hole Tolerance | +/-1mil |
| 14 | Copper Thickness of PTH Wall | >10mil(25um) |
| 15 | Line Width And Space | 2/2mil |
| 16 | Min Solder Mask Bridge | 2.5mil |
| 17 | Solder Mask Alignment Tolerance | +/-2mil |
| 18 | Dimension Tolerance | +/-4mil |
| 19 | Max Gold Thickness | 200u'(0.2mil) |
| 20 | Thermal Shock | 288℃, 10s, 3 times |
| 21 | Impedance Control | +/-10% |
| 22 | Test Capability | PAD Size min 0.1mm |
| 23 | Min BGA | 7mil |
| 24 | Surface Treatment | OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc |
Q1: What is PCB Bow and Twist?
A1: PCB Bow and Twist are parameters that determine alignment errors in a PCB board based on its flatness. The PCB Bow tests the spherical or cylindrical curvature of the board, when its four corners lie in the same plane. The PCB twist tests if any one corner of the PCB is different from the others four in terms of flatness. A board with a bow issue will lift off the surface despite all corners of the board making contact with the plane. The twist occurs when three of the PCB corners are in contact with the surface while the fourth corner is elevated.
According to the IPC-A-600 standard, boards with less than 1.5% of bow and twist are acceptable. In the case of the boards with SMD components, this percentage needs to be less than 0.75%.
PCB Bow and Twist can be used by a number of factors that include high temperature exposure, heavy thermal shocks during soldering etc. The board design, thickness, layers and materials also play a role in the board showing Bows and Twists over various fabrication, assembly or operating conditions.
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Wire Bonding 2 Layer PCB FR4 Printed Circuit Board Images
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